On 25th April, the 3rd International Forum on Compound Semiconductors, jointly organised by the Taiwan Electronic Equipment Association (TEEA) and the College of Engineering of National Taiwan University (NTU), came to a successful conclusion at the Nangang Exhibition Hall in Taipei. Aiming to promote the compound semiconductor industry in Taiwan, the forum invited heavyweight lecturers from home and abroad to exchange views on the application market of "compound semiconductors", manufacturing equipment, test equipment, and fourth-generation compound semiconductors and other related topics.

As a special guest, JiaWei-Lin, Vice President of Marketing of Semight, participated in the forum and gived a speech on "Semight Turn-Key Solution for SiC Test and Reliability", sharing Semight' complete solution and professional experience in SiC test.

The theme of this year's forum is "Compound Semiconductors", and experts from ROHM, SiCEV, Coherent, Infineon, Yole Intelligence, and other major manufacturers were invited to share specialized information on the trend of new-generation compound semiconductor technology. According to professional forecasts, SiC industry in 2023 - 2029 years, with a compound annual growth rate of 25% of rapid growth, China's production capacity will be greatly increased.

It is well known that SiC has a strong breakdown force field and higher thermal conductivity, which allows the device to operate efficiently at high voltages and up to 175°C. However, there are very obvious reliability issues with current SiC fabrication. For example, more extrinsic defects, threshold voltage drift, short-circuit capability of SiC MOSFETs, bipolar degradation reducing the active area of SiC devices, and so on. Therefore SiC device products need to undergo wafer-level burn-in tests such as HTRB, HTGB, TC, AC/PCT, etc., and KGD-level tests for high and low power devices with critical static characteristics (Vds, Igss, Idss, Rds, etc.), dynamic characteristics (Isc, td(in), td(off), Tr, Eon, etc.), and so on, before they are put on the market.

Over the years, Semight has ploughed into the core areas of SiC manufacturing and testing processes, insisted on independent research and development of core instruments, and successively launched High-Voltage Serial Parameter Test System WAT6300, Wafer-Level Burn-in System WLBI3800, SiC KGD Test System PB6400, Multi-site Wafer-Level Reliability Test System WLR0010, and other SiC-related test equipment, which provides a comprehensive turnkey solution for the research and development, production and application of SiC materials. 

With long-term high intensity R&D investment, existing R&D and production sites of more than 20,000m^2, more than 50% of R&D personnel and 30% of R&D investment, Semight is the industry's leading supplier of SiC Wafer Burn-in and KGD Test Systems, and has made excellent contributions to solving the problem of the " stranglehold " of high-end test instrumentation in China.