The sampling oscilloscope is based on equivalent time sampling and waveform reconstruction technology, enabling higher precision and more cost-effective measurement of high-speed optoelectronic signals. By configuring different filter options, it can support optical eye diagram testing under various data rates.

For the high-speed serial data, the clock information is embedded into the transmitted data stream by data encoding, and the clock information is extracted by clock recovery at the receiver, then the data is sampled according to the recovered clock. Therefore, the clock recovery is crucial for the transmission and reception of high-speed serial signals.

In the PON system, the OLT downstream data is transmitted in broadcast continuous mode, while the ONU upstream data consists of burst-mode data packets sent by multiple user terminals in the time-division multiple access (TDMA) mode. The performance of OLT receiver can be verified only by the burst error analyzer with burst mode.

Bit Error Ratio Tester is an instrument used to test and analyze bit error ratio in digital transmission systems, fiber optic communication systems, and digital microwave communication systems. It performs error detection and alarm monitoring, serving as an essential tool for bit error testing in R&D and production of optical modules/devices.

In recent years, with the adoption of PAM4 in optical module, FEC has been introduced mandatorily. It makes optical module manufacturers need to test MAC layer Traffic in addition to PRBS. Different from the traditional Bit Error Rate Tester, the Network Analyzer supports Ethernet packet test, true FEC analysis based on Ethernet frame and standard 2544 protocol test. It also could be applied to the switches for data traffic test, giving network analyzers a broader range of applications compared to Bit Error Rate Testers.

With the increasing demands of higher data rate, a large number of coherent communication modules based on wavelength-tunable lasers are used in the transmission backbone network thus a optical wavelength are applied for wavelength testing.

Optical power meters, optical switches, and optical attenuators are basic instruments used for optical power measurement, optical path switching, optical power adjustment and other application scenarios in the optical communication systems.

The optoelectronic hybrid ATE is a highly integrated testing platform for optical modules. The hardware platform consolidates a range of instruments, while the software incorporates multiple sub-modules tailored for various test functions. Hardware configurations and software modules can be optimized based on specific testing requirements, significantly reducing R&D costs, enhancing system stability, and accelerating the product launch process. This innovation marks a breakthrough in the optical module testing industry, advancing efficiency, automation, and integration to new levels!

The high-precision source measure unit integrates the functions of voltage source, current source, ammeter, voltmeter and load, and has a wide range of applications in semiconductor discrete components, photovoltaics, automobiles, batteries, nano - characterization devices and other fields.

PXIe source measure unit module, supports most of the PXIe chassis. It is convenient to integrate and extend to large-scale integrated test system.

The high-voltage source measure unit is designed for testing the characteristics of high-voltage electronic and power semiconductor devices, and is widely used in testing and research fields such as power semiconductor characteristics, GaN, SiC characterization, composite materials, and high-voltage leakage current.

RM1010-LLC 4-slot semiconductor switch matrix can meet high-speed semiconductor test applications with S3022F benchtop or S2012C PXle plug-in card source measure unit.

Supports up to 48 pins and the number of pins can be flexibly configured. Compatible with industry probe card architecture, supporting all types of universal probe station control; Self-developed sub-pA level accuracy source measure unit; Support serial and parallel test

Ultra-fast pulse source measure unit, supports narrow pulse width, fast rising edge, high-precision pulse output and measurement, widely used in testing scenarios such as medium power devices, nonvolatile memories, MEMS devices, etc.

Wafer Level Reliability testing technology can be used to provide rapid feedback on process control information about the reliability of semiconductor process products. The purpose of wafer level reliability testing is to measure changes in the materials that make up semiconductor devices.

Semiconductor lasers have the excellent characteristics of ultra-small, high-efficiency and high-speed operation, is the core devices of optical communication. Semiconductor lasers must be tested before leaving the factory, including before and after the burn-in of the product characteristics must be strictly controlled, in order to ensure the reliability and longevity.

Lasers undergo burn-in testing during the manufacturing process to identify and remove defective devices that may cause early failure. Semiconductor lasers come in a variety of packaging styles and power levels, which complicates semiconductor laser testing.

Silicon photonics is a large-scale integration technology of silicon-based optoelectronics based on photons and electronics as information carriers, which can greatly improve the performance of integrated chips, and is the basic supporting technology for emerging industries such as big data, artificial intelligence, and mobile communications, and can be widely used in big data centers, 5G, Internet of Things and other industries. Silicon photonics technology uses the working mechanism and optoelectronic characteristics of photons, electronics and optoelectronic devices in silicon materials, and uses micro-nano processing technology compatible with integrated circuits to develop and manufacture optoelectronic chips on silicon wafers.

Semight' Wafer Level Burn-in (WLBI) System utilizes advanced High-Temperature Gate Bias (HTGB) and High-Temperature Reverse Bias (HTRB) testing to ensure the reliability of Silicon Carbide (SiC) and Gallium Nitride (GaN) wafers. Designed for automotive-grade applications, it effectively identifies infant mortality in dies before module packaging, enhancing product dependability. Widely adopted across R&D, production, and quality control, the WLBI system ensures SiC modules consistently meet stringent automotive reliability standards, delivering robust and reliable performance throughout their lifecycle.

The KGD (Known Good Die) testing system is primarily used for dynamic and static parameter testing of power bare dies. It enables screening of dies after dicing, significantly improving the cumulative yield of module packaging.

Semight AL6200 Die Sorting system is mainly used in power chip die level visual inspection and sorting. The sorting condition is according to the different test specification and visual inspection.