Wafer Level Burn-In-Semight Instruments

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Home > Products > Power Chip Test > Wafer Level Burn-In >

Wafer Level Burn-In

Wafer level burn-in system is designed to perform HTGB and/or HTRB burn-in and test for SiC/GaN wafer. The burn-in system can be widely used in research and development, mass production and quality monitoring, and can strictly screen chips with risks in advance to ensure the reliability of packaged products.

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