Wafer Level Burn-In-Semight Instruments

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Wafer Level Burn-In

Semight' Wafer Level Burn-in (WLBI) System utilizes advanced High-Temperature Gate Bias (HTGB) and High-Temperature Reverse Bias (HTRB) testing to ensure the reliability of Silicon Carbide (SiC) and Gallium Nitride (GaN) wafers. Designed for automotive-grade applications, it effectively identifies infant mortality in dies before module packaging, enhancing product dependability. Widely adopted across R&D, production, and quality control, the WLBI system ensures SiC modules consistently meet stringent automotive reliability standards, delivering robust and reliable performance throughout their lifecycle.