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SiC KGD tester
2022.07.17 

Rapid development of SiC power devices

Power semiconductors are the core of electric energy conversion and circuit control of electronic devices. In essence, they are the functions of power switch and power conversion by using the unidirectional conductivity of semiconductors. Most of the chemical energy provided by hydropower, nuclear power, thermal power, wind power, and even various batteries cannot be used directly, and can only be used by equipment after power conversion by power semiconductors. The specific uses of power semiconductors are frequency conversion, phase transformation, voltage transformation, inversion, rectification, amplification, switch, etc. The related products have the function of energy saving and are widely used in the fields of automobile, communication, consumer electronics and industry.


SiC-based power devices have natural advantages in high-power application scenarios. The third-generation semiconductor materials represented by SiC have large bandgap width, high breakdown electric field, high thermal conductivity, and high electron saturation rate. Therefore, the semiconductor devices prepared by SiC have unique advantages in high voltage, high current, high temperature, high frequency, low loss and other application fields.


Yole predicts that the market size of SiC power devices will increase from US $1.09 billion in 2021 to US $6.297 billion in 2027, with a CAGR of 34%, strongly driven by the application of new energy vehicles and photovoltaic fields.


Known Good Die test

KGD (Known Good Die), through aging/testing and other methods, removes the chips (core, seed core, tube core) with failure and defect potential related to the previous process production as early as possible before packaging, improves the yield after packaging and meets the requirements of high-density multi-chip packaging, reduces production costs and time, and accelerates the product to market as soon as possible.


Unicom SiC KGD tester PB6200&PT6200

● Full-automatic test, supporting wafer, Tape&Reel loading and unloading

● Support multi-position parallel test, and different stations support different temperatures and test items

● Support static, dynamic and avalanche function test, and the test sequence is adjustable

● Support high temperature test, temperature range: room temperature~200 ° C

● Support high-temperature preheating and anti-oxidation protection of chip surface

● The charging needle card is sealed and supports nitrogen filling protection, high pressure ignition prevention and nitrogen pressure monitoring

● Higher test efficiency, test UPH>1000pcs



PB6200&PT6200

Main technical indicators



        
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