Known Good Die
PB6600
SiC KGD Die Handler
Semight Instruments PB6600 KGD Die Handler can be mainly used for power chip Die-level dynamic and static test to implement the screening of chip performance indicators and improve the first pass yield of the module after packaging. The testers in the corresponding specifications can be configured by test items, test conditions and test parameters. According to customer requirements, can supports the customized development. The system supports frame ring input and output.
特点
Strong expandability
The handler with transport part (PB6600) is separated from the test part
Six parallel tests
Support up to 6 test stations, different test stations support different test conditions and items
Dynamic and static test
Satic test 2000V/600A ,
Accurate test results
Room temperature ~ 200 ℃,
Hard docking
Stray inductance of the dynamic test system≤50nH
Nitrogen pressure test
The sealed cavity design is adopted for the probe card, with the nitrogen pressure monitoring function, which can maintain pressure and prevent arcing;
UPH capability ＞1400pcs
Single test station test time≤1s
|
Test type |
Item |
Description |
|
Static test parameters |
Vds |
Drain - Source Voltage |
|
Vth |
Gate Threshold Voltage |
|
|
Idss |
Zero Gate Voltage Drain Current |
|
|
Igss |
Gate-Source Leakage Current |
|
|
Rds(on) |
Drain-Source On-State Resistance |
|
|
Vsd |
Diode Forward Voltage |
|
Test type |
Item |
Description |
|
UIS test parameters |
Rint |
Gate Input Resistence |
|
Ciss |
Input Capacitance |
|
|
Coss |
Output Capacitance |
|
|
Crss |
Reverse Transfer Capacitance |
|
|
Eoss |
Coss Stored Energy |
|
|
AC Characteristics |
Isc |
Short-circuit Current |
|
Td(on) |
Turn-On Delay Time |
|
|
Tr |
Rise Time |
|
|
Tf(off) |
Turn-Off Delay Time |
|
|
Tf |
Fall Time |
|
|
Eon |
Turn Off Switching Energy |
|
|
Eoff |
Fall Time |
|
|
Trr |
Reverse Recovery Time |
|
|
Qrr |
Reverse Recovery Charge |
|
|
Irrm |
Peak Reverse Recovery Current |
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