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Known Good Die

PB6600

SiC KGD Die Handler


Semight PB6600 is a high-end SiC KGD Die Handler widely used in the semiconductor industry. It focuses on dynamic and static parameter testing of bare die-level SiC power chips. The system features a modular design and supports various chip incoming methods such as frame ring, tape and reel, and tray. It enables hard docking connection and multi-stations normal or high temperature test, and has a along with high voltage arching protection function. The test probe pogo-pin is professionally designed, allowing for a large flow capacity, controllable probe marks and ensuring high test stability. The system also includes functions for unloading and bin sorting with customized selection of bin sorting methods.


Features

  • Excellent Scalability

    Modular design with loading
    unloading and test stations
  • Dynamic, Static and UIS Tests

    Static test 2000V/600A
    Dynamic test 1200V/2000A
  • Hard Docking Design

    Stray inductance of the
    dynamic test system≤50nH
  • Six Parallel Test Sites

    Up to 6 sites for diverse test conditions
  • Precision Temperature Control

    Room temperature ~ 200 ℃,
    accuracy<±3°C, resolution: 0.1°C
  • Airtight Socket Design

    Supports nitrogen gas for arcing protection with integrated pressure monitoring
  • High Throughput

    Up to 1,400 UPH @ 1s test time for Known Good Die

Category

Parameter

Specification

Remarks

Basic Parameters

Die Size

2.5*2.5mm-8*8mm

 

Die Thickness

100-400μm

 

P&P Accuracy

±30μm

 

Temperature System

Temperature Range

RT to 200℃

 

Resolution

0.1℃

 

Tolerance

≤±3℃

 

Vision Inspection

System

Inspection Accuracy

≥12μm 

Grayscale contrast ratio shall more than 40

Defect

Top/bottom:scratch, dirt, contamination, burn mark, defect, chipping

Supports top inspection with below details:
scratch (length>30μm, width>12μm),
dirt(30μm),

contamination(30μm),

burn mark(30μm)

 

Supports bottom inspection with below details:

chipping(12μm), defect(12μm),

contamination(30μm),

scratch(length>30μm, width>12μm),

dirt(30μm), and etc.

 

Exact defect details determined based on customer DUT process.

 

Software may mark, record, and save the captured image.

 

Side:

Supports singulated line inspection
(width>12μm, length>30μm),

chippig

(depth>30μm, width>20μm), and etc.

 

 

Stability

MTBF

>168H

 

MTBA

>2H

 

MTTA

5 min

 

MTTR

<30 min

 

Drop Rate

≤0.01%

 

Fragmentation Rate

≤0.01%

Due to P&P

Probe Depth

≤2μm

 

Drain Kelvin

≤2Ω

TiNiAg material

Efficiency

Single Die

≥1400pcs/h

Test time ≤1s

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Details
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