Features

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  Fully automated and intelligent integrated solutions

  Highly integrated and fully automated solution covering very complex testing processes
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  High efficiency

  Improve efficiency and reduce potential risks of human involvement
  Automatic switching of collimated fibers and large area photodetectors
  Automatic sorting of DUTs after testing
  
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  Maintenance and upgrades are very simple

  All mechanical parts can be returned to the factory independently
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  Easy to use

  Automatic alarm status and prompt display,
  All instruments, test plans, pass/fail criteria are easily configurable

Features and Benefits

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  Fully automated and intelligent integrated solutions

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  Loading module

  This module consists of thimble Z module, X/Y motion module, and blue film rotation module 4 sub-function modules. Pickup function.
  Compatibility mode of Chip package: 1 x 6-inch chip expansion ring.
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  High temperature and normal temperature test module

  This module consists of a hollow rotating platform, two 3-axis chip calibration modules on the front and back, and a 3-axis light detection module, with an ID/position recognition camera above the module, and Power on the probe to adjust the module, complete the calibration of the position and angle after feeding, and power on the chip test. The PD/collimator uses a motion axis for fast switching of functions.
  The temperature of the test bench can be independently set according to the process, and the temperature is stable<±0.2℃.
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  Camera and probe power-on module

  The loading camera on the right side of the device is matched with the loading module to complete the loading recognition function of the Chip (different functional components can be matched according to the requirements of incoming materials) The camera above the high/normal temperature test module (in the middle of the device), after the chip feeding action is completed, the position calibration of the chip is completed by taking multiple pictures with the 3-axis motion module (the high temperature camera synchronously completes the ID identification of the chip).
  Probe power-on adjustment module, each set is equipped with up to 3 sets of probes (backlight PD sub-function module is optional), different combinations can be used to test related parameters such as LIV/extinction ratio of DFB/EML products.
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  Blanking binning module

  The blanking module is equipped with 4 tray placement areas, which can support 4,6-inch blue films, Or customize compatible unloading carriers according to customer needs.