Laser Diode Burn-in
BI6201
CoC Burn-In System
The BI6201 burn in system is a high-density, multi-functional testing system specifically designed for the verification of the aging lifespan of semiconductor laser chips. The system adopts a modular framework and a large single-layer structure, significantly reducing system costs by integrating multi-channel power supplies, temperature controllers, real-time data acquisition capabilities, as well as standardized drawers and flexible fixture configurations. Customized test fixtures are suitable for various packaging types of semiconductor lasers, such as CoC (Chip on Carrier), TO-Can, etc., of different sizes. The fixtures can be easily replaced to accommodate different device types. The driving circuit of BI6201 features excellent protection networks to prevent any current or voltage overshoot, eliminating potential EOS risks. It also allows setting thresholds for current and voltage, and the system can shut down abnormal channels when the output values exceed the threshold, providing enhanced protection for the tested chips. In addition to integrating protection functions into the control circuit, the system design also considers channel-to-channel isolation performance and electrostatic discharge (ESD) protection.
Feature
SMU drive power supply
Support up to 4224 channels of 4-quadrant SMU drive power supply
Support LIV / EA sweep
Online power monitoring, supporting complete liv/EA sweep
Analytical ability
With ith and DCER analysis ability, test repeatability deviation < 1%
Large capacity
4224 four-quadrant electrical channel design make the system very flexible;Functions and advantages
Special temperature control structure with excellent thermal conductivity
CoC, CoS drawer and clamp
Support automatic current control, automatic power control, safe
CoC, CoS drawer and clamp with online monitoring power (support liv scanning and power measurement)|
System index |
DUT Type | CoC, TO46, TO56 |
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Fixture type | 48pcs CoC fish bone fixture |
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System capacity |
11 Layers, 44 Drawers, 88 fixtures, total 4224 channels |
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Nitrogen protection |
Nitrogen protection function option can be integrated |
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Power supply |
AC 380V, 50/60Hz 32A |
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Pressure |
0.4-0.6Mpa |
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Weight |
<1000kg |
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Size |
984*1102*2030mm |
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Burn-in testing of laser is an important method to ensure the reliability of laser. Through the test of COC or bare die, the early failure of laser caused by the defects in the process of laser production can be screened out in advance. Semight Instrument provides a complete solution from bare die to COC, from high temperature(150℃ or higher) to low temperature (-40℃), with CoC automatic loading and unloading system, forming a complete test solution, Semight Instrument's laser chip burn-in/load/unload test system has been widely recognized by the market.
Details
The semiconductor front-end test is mainly used in the wafer processing to check whether the processing parameters of the wafer products meet the design requirements or there are defects affecting the yield after each step of the manufacturing process. The semiconductor back-end test equipment is mainly used after wafer processing to check whether the performance of the chip meets the requirements, which belongs to the electrical performance test. Semight Instrument provide integrated solutions such as wafer burn in and known good die tester, improve test efficiency and reduce test cost.
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