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SiPh Test ┃ Semight assists in testing and measurement of silicon-based optical chips
2025.01.17 

Semight has released the SiPh Wafer Test System sCT9001, which features high testing accuracy, strong testing stability, and flexible scalability, making it suitable for laboratory validation and mass production testing.




With the rapid development of application markets such as 5G, cloud data, blockchain, cloud computing, the Internet of Things, and artificial intelligence, there has been an explosive growth in data traffic. There is an urgent need for communication networks to have higher transmission rates, greater reliability, and better cost-effectiveness.


Silicon photonics technology is a new generation technology based on silicon and silicon-based substrate materials, utilizing existing CMOS processes for the development and integration of optical devices. It combines the characteristics of ultra-large scale and ultra-high precision manufacturing of integrated circuit technology with the advantages of ultra-high speed and ultra-low power consumption of photonic technology, making it the mainstream solution for large-scale optoelectronic integration in the future.


Unlike conventional large-scale integrated circuit chips, optoelectronic chips (especially laser chips) have high material costs (III-V, II-IV groups), complex manufacturing processes, and intricate technologies. Additionally, silicon photonic chips are small in size and have high integration density, requiring numerous testing items and parameters, including optical-optical testing, optical-electrical testing, electrical-electrical testing, and radio frequency testing. Therefore, on-wafer testing is extremely important.


Semight combines its core advantages in the automation control of complex precision probes and its professional accumulation in the testing and measurement field to release the sCT9001 fully automatic SiPh Wafer Test System. It meets the needs of customers for wafer-level chip optoelectronic performance testing and measurement.


sCT9001 Key Features

  • Supports fully automatic and semi-automatic methods for handling wafers
  • Supports 8-inch and 6-inch wafers (4-inch and 12-inch can be customized)
  • Supports test temperature range room temperature to 150℃ (other temperatures can be customized)
  • Supports for optical testing, optoelectronic testing, and electrical parameter testing
  • Supports DC and AC testing
  • Supports for raster, FA coupling, and edge coupling
  • Equipped with a wafer height tester to solve the flatness issue of the wafer on the chuck
  • Supports quick replacement of different types of probe cards for different types of chips



        
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