Feature

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  Automatic/Semi-automatic

  Support automatic and semi-automatic wafer loading and unloading;
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  Wafer size

  Supports 8-inch and 6-inch wafers；
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  Test temperature

  Support the test temperature range from room temperature to 150 ℃ (other temperatures can be customized);
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  Test function

  Support optical-optical test, photoelectric test and electrical parameter test;
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  DC/AC

  Support DC and AC test;
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  Grating vertical coupling

  Support grating vertical coupling;
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  High efficiency

  For different types of chips, support rapid replacement of different types of pin cards;
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  Software function

  The software supports the addition of customer database and MES functions;

Functions and advantages

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  High accuracy probe station:

  Wafer loading mode supports fully automatic mode and semi-automatic mode operation, which is suitable for laboratory verification and mass production;

  The fully closed-loop high-accuracy motion control system is provided with automatic accuracy compensation function and its positioning accuracy is up to 3um;

  The special mechanism design and calibration system can make the wafer on chuck have better planarity and better perpendicularity in Z direction of probe;

  A high-definition zooming CCD configured on the system can make the power on PAD clearly visible and display low-magnification and high-magnification multi-view screens at the same time;

  The built-in integrated shock-proof design is adopted which can isolate the external vibration and ensure a good test stability;

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  Coupling test module:

  The coupling test module includes coupling optical probe, DC probe and RF probe;

  The optical probe supports single-channel coupling and dual-channel coupling;

  The optical probe is provided with a high-precision altimeter to ensure the consistency of the height from the incident fiber end face to the chip surface between different chips;

  The optical fiber coupling module is composed of a three-dimensional lead screw motor matched with a three-dimensional high-precision piezoelectric ceramic module to ensure the optical coupling efficiency and the optical coupling repeatability;

  The standard high-precision coupling controller configured on the system which can help the system realize the functions of fully closed-loop control and hardware synchronization improve the coupling accuracy and coupling speed;

  The design of the probe card holder is more convenient for the replacement of the probe card, which is convenient to quickly replace the probe card for different products or different test items;