Semight' Wafer Level Burn-in (WLBI) System utilizes advanced High-Temperature Gate Bias (HTGB) and High-Temperature Reverse Bias (HTRB) testing to ensure the reliability of Silicon Carbide (SiC) and Gallium Nitride (GaN) wafers. Designed for automotive-grade applications, it effectively identifies infant mortality in dies before module packaging, enhancing product dependability. Widely adopted across R&D, production, and quality control, the WLBI system ensures SiC modules consistently meet stringent automotive reliability standards, delivering robust and reliable performance throughout their lifecycle.

The KGD (Known Good Die) testing system is primarily used for dynamic and static parameter testing of power bare dies. It enables screening of dies after dicing, significantly improving the cumulative yield of module packaging.

Semight AL6200 Die Sorting system is mainly used in power chip die level visual inspection and sorting. The sorting condition is according to the different test specification and visual inspection.