Please enter search keywords!

Site Map

Site Map

Laser Diode Burn-In

BI6202

CoC Burn-in System



The BI6202 Burn-in System is a high-density, multi-functional testing system specifically designed for the verification of the burn-in lifespan of semiconductor laser chips.

The system adopts a modular framework and a large single-layer structure. Integrated multi-channel power supplies, temperature controllers, real-time data acquisition capabilities. Standardized drawers and flexible fixtures are suitable for various sizes of CoC (Chip on Carrier). The fixtures can be easily replaced to adapt with different types of devices. Drawers could be replaced when new test functions are added, such as thermistor monitoring, power monitoring.


  • Driving Power Supply

    Supports up to 8448 channels standard power supply
  • Strong Thermal Conductivity

    Temperature deviation < ±1.0℃ for the overall thermal sink(40~100℃)
  • Temperature Control

    Each fixture has independent heating, temperature control, monitoring, over temperature protection and heat dissipation units for energy saving
  • Fixture

    Fishbone-type fixture which support wire bonding on it
  • Safety and Reliability

    Comprehensive protection mechanisms through hardware and software eliminate potential issues such as EOS
  • Online Power Monitoring

    Optional configuration for online power monitoring, supporting complete LIV or EA scans, with the ability to analyze Ith. The test repeatability deviation <±1%
  • 4224 CoC Simultaneously Burn-in

    Production capacity flexibly configured based on customer requirements
  • Software Functions

    All test results, test statuses, and abnormal conditions are recorded in the database which could be stored and traced efficiently

Functions and Advantages


  • Special Temperature Control Structure with Excellent Thermal Conductivity

    CoC, CoS drawer and clamp

No.

Module

Part number

Description

1

CoC Burn-in System cabinet (including computer)

P09000037

Main frame, computer, software(remark: up to 11 layers)

2

CoC Burn-in System single layer (including Driving board)

P02004448

- 96 channels standard driving board

- Switch mode power supply

- Temperature control module

- Back panel

- CDA N2 control system 

3

Burn-in drawer

P02004255

- Double fixtures with 96 channel PD

- Drawer temperature range 40~120℃

- G4 long fixture, fixture bottom plate thickness 2mm & 1mm

FB020100

- Drawer temperature range 40~120℃

- G4 long fixture, fixture bottom plate thickness 1mm

4

Burn-in fixture(including up and bottom fixtures)

 

- Supports 48 channel DML CoC 

5

Load board

 

5Ω resistor board

Similar recommendation

High Speed Communication Test
High Speed Communication Test

High speed communication test plays an important role in the rapid development of big data, cloud computing, 5G communication and other markets.
Semight offers various of instruments for optical Transceiver/Component testing, including wide bandwidth sampling oscilloscope, NRZ/PAM4 bit error ratio tester , burst error ratio tester, fast wavelength meter, optical spectrum analyzer, high precise source measure unit, 400G network analyzer ,optical power meter, optical attenuator, optical switch etc. We provide cost-effective, complete solutions for optical testing.

Details
Electronic Measurement
Electronic Measurement

The high-precision source measure units integrates the functions of voltage source, current source, voltmeter, ampere meter, and electronic load in one, which is widely used in high-precision IV test and measurement for various discrete components, photovoltaic, green energy, battery and other industries. Semight provides high-precision benchtop SMU and plug-in PXIe SMU of standard PXIe chassis, fully meeting the application of various test scenarios.

Details
Optical Chip Test
Optical Chip Test

Burn-in testing of laser is an important method to ensure the reliability of laser. Through the test of CoC or bare die, the early failure of laser caused by the defects in the process of laser production can be screened out in advance. Semight provides a complete solution from bare die to CoC, from high temperature(150℃ or higher) to low temperature (-40℃), with CoC automatic loading and unloading system, forming a complete test solution, Semight's laser chip burn-in/load/unload test system has been widely recognized by the market.

Details
Power Semiconductor Test
Power Semiconductor Test

The semiconductor front-end test is mainly used in the wafer processing to check whether the processing parameters of the wafer products meet the design requirements or there are defects affecting the yield after each step of the manufacturing process. The semiconductor back-end test equipment is mainly used after wafer processing to check whether the performance of the chip meets the requirements, which belongs to the electrical performance test. Semight provides solutions such as Wafer Level Burn In system and Known Good Die handler for SiC testing, offering the value to customer in test efficiency improvement and test cost reduction.

Details
Log in

Account number

Password

Register an account

Name

Please enter your name *

E-mail

Please enter your email address *

E-mail verfication code

Please enter your email verification code

Phone

Please enter your contact number

Password

Please enter your login password *

Confirm Password

Please enter your login password again *
Reset password

E-mail address

Please enter your email number *

E-mail verification code

Please enter your email verification code

New Password

Please enter your login password *

Confirm Password

Please enter your login password again *