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Known Good Die

PB6400

KGD Test System


Semight Instruments PB6400 KGD Test System can be mainly used for power chip Die-level dynamic and static test to implement the screening of chip performance indicators and improve the first pass yield of the module after packaging. The testers in the corresponding specifications can be configured by test items, test conditions and test parameters. According to customer requirements, can supports the customized development. The system supports a variety of chip packaging methods, such as blue tap, Gelpak, Waffle Pack and Tape &Reel.



Feature

  • The flexible design is adopted

    The handler with transport part (PB6400) is separated from the test part, so the strong expandability is provided
  • Multiple parallel test

    Maximum of 4 test stations are supported, and the different test station support different test conditions and items
  • Support dynamic and static parameter test

    Up to 2000V/300A static test, 2000V/1200A dynamic test
  • High temperature uniformity

    room temperature ~ 200 ℃
    Uniformity ± 0.5 ℃, accuracy 0.5 ℃, resolution 0.1 ℃
Parameter

Indicators

Applicable products SiC chip
Wafer size

6 inches and 8 inches

Static parameters Vds, Vth, Idss, Igss, Rds(on), Vsd
Dynamic parameter Eas, Rint, Ciss, Coss, Crss, Eoss
Switch parameter Isc, Td(on), Tr, Tf(off), Tf, Eon, Eoff, Trr, Qrr, Irrm, 
System power consumption <10kW
Nitrogen protection 2~5Bar
Temperature range Room temperature~200℃
Number of AC test stations

Number of test stations which support customization

Number of DC test stations

Number of test stations which support customization

Current and voltage overshoot

No overshoot under any circumstances

MES docking Support MES docking

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